Specific features of WACKER® PASTE P 12

  • Thermally conductive

WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a semiconductor to a cooling element, it is advisable to apply a thin coating of WACKER® PASTE P 12. In the assembly of semiconductors, e. g. diodes, transistors and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. When assembled, a firm metal-to-metal contact might be hampered by these surface irregularities. A significant percentage of the device's surface therefore might lack direct contact to the heatsink. Remaining gaps are filled with air, providing relatively poor thermal conductivity.

By coating the contact surfaces with WACKER® PASTE P 12, surface irregularities will be filled with the heat sink silicone paste. The thermal conductivity of WACKER® PASTE P 12 is about 20 times better than that of air. Practical experience has shown that by using WACKER® PASTE P 12, the heat transfer resistance from the semiconductor housing to the cooling elements is reduced by 50 %.


WACKER® Paste P 12 can be applied with a brush, spatula or by screen printing. Best results are achieved when a uniform, thin coating is applied to the mating surfaces. Excess paste that's squeezed during assembly should be removed.


Store in a dry and cool place.

The 'Best use before end' date of each batch is shown on the product label.

Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

Sales and support

Wacker Chemical Corporation
3301 Sutton Road
Adrian, MI 49221-9397
United States
+1  888  922-5374 (Phone)

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