SEMICOSIL® 924


Properties

  •  one-part, ready-to-use
  •  thixotropic flow
  •  forms a soft gel on vulcanization
  •  low content of volatiles
  •  low content of uncured polymer
  •  low ion content
  •  almost constant properties between –50 °C and +180 °C
     

Disclaimer

All the information provided is in accordance with the present state of our knowledge. Nonetheless, we disclaim any warranty or liability whatsoever and reserve the right, at any time, to effect technical alterations. The information provided, as well as the product's fitness for an intended application, should be checked by the buyer in preliminary trials. Contractual terms and conditions always take precedence. This disclaimer of warranty and liability also applies particularly in foreign countries with respect to third parties' rights.

Because of the thixotropic behavior, SEMICOSIL® 924 is specially recommended for local encapsulation of delicate electronic components, e.g. bonded chips on hybrid components which are exposed to extreme external influences.

Surface preparation
All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 924. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.


Dispensing
Because of the thixotropy (shear thinning effect) SEMICOSIL® 924 can be dispensed easily with all dispensing equipments.

To eliminate any air introduced during dispensing or trapped under components or devices a vacuum encapsulation is recommended.


Curing
SEMICOSIL® 924 works best when cured at 100 °C or more depending on the size and heat sink properties of the components.


The reactivity can be adjusted within wide limits by adding Catalyst EP or Inhibitor PT 88 to suit the processing requirements of the particular application. Catalyst EP increases the reactivity, i. e., pot life and curing time are reduced.
Inhibitor PT 88 is a pot life extender and prolongs pot life and curing time. Further information is given in our leaflet “Catalyst EP/Inhibitor PT88”.


We recommend running preliminary tests to optimize conditions for the particular application.
 

Storage

The 'Best use before end' date of each batch is shown on the product label.

Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

Sales and support

Wacker Chemical Corporation
3301 Sutton Road
Adrian, MI 49221-9397
United States
+1  888  922-5374 (Phone)
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