Eigenschaften

  •  one-part, ready-to-use
  •  thixotropic
  •  transparent
  • medium hardness
  • high flexbility
  • rapid heat curing
  • primerless adhesion to many substrates
  • general purpose adhesive for the electronics industry
  •  FIPG applications

Surface preparation
All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 989/1K. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.

Dispensing
Because of the thixotropy (shear thinning effect) SEMICOSIL® 989/1K can be dispensed easily with all dispensing equipments.

To eliminate any air introduced during dispensing or trapped under components or devices a vacuum encapsulation is recommended.

SEMICOSIL® 989/1K shows good primerless adhesion to many substrates. We recommend running preliminary tests to optimize conditions for the particular application.

Curing
SEMICOSIL® 989/1K works best when cured at 115 °C or more depending on the size and heat sink properties of the components.

Lagerung

The 'Best use before end' date of each batch is shown on the product label.

Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

Vertrieb & Support

Wacker Chemie AG
Heilbronner Strasse 74
70191 Stuttgart
Deutschland
+49  711  61942-0 (Phone)
+49 711 61942-61  (Fax)
Kontakt

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