DEHESIVE® PSA 850 R
DEHESIVE® PSA 850 R is a solvent based Silicone Pressure Sensitive Adhesive intended in particularly for coating on films, but also other substrates.
- excellent surface tack
- high adhesion levels
- high flexibility
- excellent thermal stability
- good resistance to moisture, weathering and ageing
Specific features of DEHESIVE® PSA 850 R
All the information provided is in accordance with the present state of our knowledge. Nonetheless, we disclaim any warranty or liability whatsoever and reserve the right, at any time, to effect technical alterations. The information provided, as well as the product's fitness for an intended application, should be checked by the buyer in preliminary trials. Contractual terms and conditions always take precedence. This disclaimer of warranty and liability also applies particularly in foreign countries with respect to third parties' rights.
Comprehensive instructions are given in the corresponding Material Safety Data Sheets. They are available on request from WACKER subsidiaries or may be downloaded via WACKER web site http://www.wacker.com.
DEHESIVE® PSA 850 R can be used for coating of several film-substrates such as Polyester, Polyamide, Polyimide and others substrates for manufacture of different silicone pressure sensitive adhesive tapes and other articles.
DEHESIVE® PSA 850 R can be diluted with aliphatic or aromatic solvent (e.g. toluene, white spirit, naphtha). It is typically blended with addition curing silicone PSA system (e.g. DEHESIVE® PSA 765). For an optimum balance of surface tack, adhesion strength and cohesive strength it is necessary to cure the coated DEHESIVE® PSA 850 R for 1 – 2 min. at 140 – 150°C by using additing DEHESIVE® 765 and catalyst C05 or PT 5. It is recommended to remove the solvent before curing process at 80 – 90 °C for ~0.5 min. Higher temperature can cause incorporation of the solvent into the adhesive film, which can impair the adhesive properties.
For tape applications DEHESIVE® PSA 850 R can be formulated with a peroxide-crosslinker e.g. Bis-(2,4-dichlorobenzoyl peroxide, which is added in a concentration of 0.5 –3.0 wt.%. With higher peroxide levels the crosslinking
density and cohesion strength can be increased, while
adhesion strength is lowered.
For an optimum balance of surface tack, adhesion
strength and cohesive strength it is necessary to cure
the coated DEHESIVE® PSA 850 R for 2 – 5 min. at
140 – 150°C by using Bis-(2,4-dichlorobenzoylperoxide
and at 170 – 200°C in case of Dibenzoylperoxide
is used. It is recommended to remove the
solvent before curing process at 80 – 90 °C for 2 – 4
min. Higher temperature can cause premature
decomposition of the peroxide-crosslinker and
incorporation of the solvent into the adhesive-film,
which can impair the adhesive properties.
The 'Best use before end' date of each batch is shown on the product label.
Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.
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