•  one-part, ready-to-use
  •  thixotropic
  •  transparent
  • medium hardness
  • high flexbility
  • rapid heat curing
  • primerless adhesion to many substrates
  • general purpose adhesive for the electronics industry
  •  FIPG applications

Surface preparation
All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 989/1K. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.

Because of the thixotropy (shear thinning effect) SEMICOSIL® 989/1K can be dispensed easily with all dispensing equipments.

To eliminate any air introduced during dispensing or trapped under components or devices a vacuum encapsulation is recommended.

SEMICOSIL® 989/1K shows good primerless adhesion to many substrates. We recommend running preliminary tests to optimize conditions for the particular application.

SEMICOSIL® 989/1K works best when cured at 115 °C or more depending on the size and heat sink properties of the components.


The 'Best use before end' date of each batch is shown on the product label.

Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

Sales and support

Wacker Chemical Corporation
3301 Sutton Road
Adrian, MI 49221-9397
United States
+1  888  922-5374 (Phone)

How can we help you?

  • Do you need help in choosing a product or do you require technical support? If so, please contact our experts.
Ask a question


My media

My favorites

My products