Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating.


Special features of WACKER® SILICONE PASTE P 12

  • Thermally conductive


All the information provided is in accordance with the present state of our knowledge. Nonetheless, we disclaim any warranty or liability whatsoever and reserve the right, at any time, to effect technical alterations. The information provided, as well as the product's fitness for an intended application, should be checked by the buyer in preliminary trials. Contractual terms and conditions always take precedence. This disclaimer of warranty and liability also applies particularly in foreign countries with respect to third parties' rights.

WACKER® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a semiconductor to a cooling element, it is advisable to apply a thin coating of WACKER® SILICONE PASTE P 12. In the assembly of semiconductors, e. g. diodes, transistors and thyristors, microscopic elevations exist on the mating surfaces of the semiconductor and the cooling surface if they have not been grounded and polished. When these surfaces are placed together, a firm metal-to-metal contact will result only where there are these elevations. 40 - 60 % of the surface is thus not in direct contact, depending on the roughness. This means that the hollow spaces in between these elevations are filled with air, which has relatively poor thermal conductivity.

By coating the contact surfaces with WACKER® SILICONE PASTE P 12, the thermally insulating air is replaced by the heat sink silicone paste when the semiconductor is screwed on. The thermal conductivity of WACKER® SILICONE PASTE P 12 is about 20 times better than that of air. Practical experience has shown that by using WACKER® SILICONE PASTE P 12, the heat transfer resistance from the semiconductor housing to the cooling elements is reduced by 50 %.

WACKER® SILICONE PASTE P 12 can be applied with a brush, spatula or by screen printing. Best results are achieved when a uniform, thin coat is applied to the mating surfaces. Paste squeezed out when the semiconductor is tightened should be removed.

For detailed information, refer to brochures on www.wacker.com.



Further information for storage:

Store in a dry and cool place.

The 'Best use before end' date of each batch is shown on the product label.

Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

Sales and support

Wacker Chemical Corporation
3301 Sutton Road
Adrian 49221-9397
United States
+1  888  922-5374 (Phone)
+1 517 264-8246  (Fax)

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