DEHESIVE® SF 500 US

DEHESIVE® SF 500 US   is a solvent-free, addition-curing silicone fluid. It is designed for release applications and applied with additional components on paper and filmic substrates.



Eigenschaften

  • Rapid curing
  • Low release force at low peel speed
  • Dynamically raising RF profile;
  • In-line processing possible
  • Suitable for versatile PSA adhesives
  • Very low volatiles content
  • Very long pot life

1. First pour in CRA® modifier in case CRA® is used.

2. Add DEHESIVE® SF 500 US  in several portions and stir slowly until the mixture is homogeneous.

3. Thoroughly stir in crosslinker. 

4. Slowly stir in catalyst. Local over-concentrations must be avoided.


Make sure that catalyst poisons are avoided in batch preparation and processing steps. 

Compounded batches may emit small amounts of hydrogen, but only for a short time. Storage in ventilated containers is recommended to avoid pressure formation.

Coating :

Modern coating systems are particularly effective with DEHESIVE® systems. The batch is best added directly to the nip of the coating unit.

 

 

Lagerung

Store in dry and cool place.


The 'Best use before end' date of each batch is printed on the product label.

Vertrieb & Support

Wacker Chemical Corporation
S State Road 4950
Ann Arbor, MI 48108
USA
+1  888  922-5374 (Phone)
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