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Processing Operations for Electronics

Room temperature vulcanizing silicone elastomers from WACKER reliably protect against external influences and thus ensure the functional reliability of electrical and electronic components. As one of the market leaders in silicones with many years of expertise in the special manufacturing processes and material requirements of these applications, we are a competent partner of the industry with tailor-made solutions for the areas of potting, bonding, sealing and coating.

Efficient and Reliable Products for Thermal Management.

Wide Product Portfolio in:

  • Adhesives
  • Gap fillers
  • Pastes
  • Encapsulants


  • Excellent thermal conductivity for heat dissipation (0.5 – 4.8 W/mK)
  • Maintains physical property and full performance in extreme temperatures (-45 °C to + 150° C)
  • Superb flow and processing properties for dispensing ease
  • Conforms and adheres to component shape – good wetting properties
  • Low volatile content
  • Firm yet flexible mechanical bond that doesn’t require further fixing


  • Electric vehicle batteries
  • Battery management systems (BMS)
  • Power electronics
  • On-board chargers (OBC)
  • Electronic control units (ECUs)
  • Sensors
  • Consumer electronics

Our Thermal Management Portfolio

  Gap Fillers Adhesives Grease / Paste Encapsulants / Potting
Thermal conductivity (TC) 1.8 – 4.8 W/mK 0.85 – 4.2 W/mK 0.7 – 4.0 W/mK 0.5 – 4.0 W/mK
Curing type Addition Addition / condensation Non-cure Addition
Viscosity Non-flowable Semi-flowable Non-flowable / pasty Flowable
Bond line thickness 50 – 150 µm < 150 µm < 150 µm < 150 µm
Processing Static mixer (2K) Static mixer (2K) Static mixer (2K), screen printing (2K) Static mixer (2K)

Main Properties:

  • Sticky gels with physical adhesion (independent on substrate)
  • For applications with cover/lid
  • Low modulus (10-100 kPa)
  • Minimum thermal stress on sensitive electronics
  • Broad range of application temperatures (-45 - +180°C)
  • Superior reliability
  • Low ion levels
  • Low bleeding
  • Tailor made processing properties for fast mass production
  • Room temperature or heat cure (1-part)
  • Self-levelling and thixotropic gels
  • Excellent inherent tack
  • Repairability


  • Sensitive electronic devices
  • ECUs
  • Power Modules
  • Discrete devices (glob tops)
  • Sensors
  • Displays
  • Wire-bonded ICs

Main Properties:

  • Low viscosities of approx. 1,000 mPa*s
  • Higher resistance to mechanical and environmental stress
  • Increased internal strength
  • Suitable for applications without housing
  • Increased hardness measured in Shore 00 or Shore A


Suitable for requirements with inceased hardness, such as

  • Voltage regulators,
  • Transformer potting,
  • Coil potting or
  • Junction boxes for PV applications.

Main Properties:

  • Low modulus sealing adhesives
  • Ability to bond
  • Flowable to non-sag
  • Sealing cover/lids and housing
  • Pronounced damping properties
  • Broad temperature range (-45°C- +180°C)
  • Minimum thermal stress
  • Maximum reliability and long-term performance
  • Tailor made properties for efficient and fast production processes
  • Good vibration damping
  • Minimum thermal stress


  • Electronic components
  • FIPG and CIPG applications
  • Housing and lids made from PBT, PA and aluminum
  • Suitable for automated processes

Main Properties:

  • Versatile processing, such as dispensing and spraying


Suitable for protecting sensitive electronics, such as

  • PCBs
  • Hybrid devices
  • Surface mounted devices