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Press Photos
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VINNAPAS® 4800 G - Polymer Powder
Gypsum joint in drywall: VINNAPAS® 4800 G is a new dispersible polymer powder ideal for enhancing ecologically sound, gypsum-based joint fillers and jointing compounds for drywall applications. Gypsum mortars containing the powder yield smooth, crack-free surfaces, are easy to apply and offer excellent adhesion.
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Pad Printing
A silicone pad (shown here in blue) is used for printing on sensitive components. Room-temperature-vulcanizing silicone rubber grades are elastic and exhibit considerable rebound resilience, making them suitable for producing these kinds of transfer pads.
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WACKER ACADEMY Tsukuba
Practical training at the WACKER ACADEMY: seminar participants at the Tsukuba training center can put what they have just learned into practice.
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SEMICOSIL® 975 TC - Semiconductor Components
Tightly packed semiconductor components, such as IGBTs, in motor controllers and LED packages can become very hot. Such components are mounted on heat sinks to prolong their lifetime. The new thermally conductive SEMICOSIL® 975 TC silicone adhesive from WACKER bonds the parts mechanically and ensures optimum heat transfer.
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Silicone Adhesive SEMICOSIL® 975 TC
The new thermally conductive SEMICOSIL® 975 TC silicone adhesive from WACKER is applied to the heat sink. As the electronic component is pressed on, the adhesive forms a thermal interface (TIM). The adhesive layer transfers the heat of the device efficiently to the heat sink.
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