SEMICOSIL® 988 TIC
SEMICOSIL® 988 TIC is a non-slump, thermally curable, addition-curing, one-part silicone rubber with excellent insulation properties. This product is optimized for insulation coating applications for disk power semiconductors.
• Ready-to-use, one-part system
• Medium hardness
• High flexibility (low-stress adhesive)
• Rapid heat cure
• Excellent primerless adhesion on many substrates
• Excellent insulation properties
• Low ion content
• General-purpose adhesive for the electronics industry
• FIPG and CIPG applications
• Power semiconductor insulation coating
All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 988 TIC.
Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds.
If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.
Because of the high thixotropy (shear thinning effect) SEMICOSIL® 988 TIC can be dispensed easily with all dispensing equipments.
SEMICOSIL® 988 TIC works best when cured at 125 °C or more depending on the size and heat sink properties of the components.
SEMICOSIL® 988 TIC shows good primerless adhesion to many substrates. We recommend running preliminary tests to optimize conditions for the particular application.
SEMICOSIL® 988 TIC should be stored between 5 °C and 25 °C in the tightly closed original container. The 'Best use before end' date of each batch is displayed on the product label.
Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality as-surance reasons.