SEMICOSIL^® 964

The performance of SEMICOSIL^® 964 is dependent upon many factors, including the application method, the thickness of the layer deposited, the substrate, the curing atmosphere. Surface Preparation The surface to be coated should be clean and free of dirt and other contaminants. SEMICOSIL^® 964 is not recommended for use with acrylic or polycarbonate substrates. Application SEMICOSIL^® 964 is best applied by spraying or dipping. A coating thickness of 5 to 10 mils is recommended for best results. Application equipment may be cleaned using organic solvents such as mineral spirits. All traces of solvent should be removed from application equipment before using SEMICOSIL^® 964. Because SEMICOSIL^® 964 begins to cure on contact with atmospheric moisture, all containers should be tightly closed when not in use. Dip tanks should be no more than half full and blanketed with a dry, inert gas such as nitrogen. If a skin should form over the surface it may be removed by careful skimming. Spray equipment and brushes should be washed and wiped clean with organic solvents such as naphtha or mineral spirits after use. Curing Curing will vary depending on exposure conditions, e.g., a 5 mil coating cured with 0.5% CO_{2 and 50% RH will be cured through in 10 minutes. Optimum cure conditions for full cure of a 128 micron (5 mil) thick film in less than five minutes.}

• Relative humidity: 10 to 35%
• _{2 level: 0.1 to 1% CO}
• _{Exhaust rate: > 450 cfm}

_{SEMICOSIL^® 964 is a sprayable conformal coating designed to protect electronic circuits from environmental influences.}