WACKER® SILICONE PASTE P 12
Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating.
WACKER® SILICONE PASTE P 12的特殊性能
WACKER® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a semiconductor to a cooling element, it is advisable to apply a thin coating of WACKER® SILICONE PASTE P 12. In the assembly of semiconductors, e. g. diodes, transistors and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. When assembled, a firm metal-to-metal contact might be hampered by these surface irregularities. A significant percentage of the device's surface therefore might lack direct contact to the heatsink. Remaining gaps are filled with air, providing relatively poor thermal conductivity.
By coating the contact surfaces with WACKER® SILICONE PASTE P 12, surface irregularities will be filled with the heat sink silicone paste. The thermal conductivity of WACKER® SILICONE PASTE P 12 is about 20 times better than that of air. Practical experience has shown that by using WACKER® SILICONE PASTE P 12, the heat transfer resistance from the semiconductor housing to the cooling elements is reduced by 50 %.
WACKER® SILICONE PASTE P 12 can be applied with a brush, spatula or by screen printing. Best results are achieved when a uniform, thin coating is applied to the mating surfaces. Excess paste that's squeezed during assembly should be removed.
For detailed information, refer to brochures on www.wacker.com.
Store in a dry and cool place.
The 'Best use before end' date of each batch is shown on the product label.
Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.