SEMICOSIL® 979 EC
Properties
- Low volume resistivity
- Thixotropic paste
- Solvated
- Excellent adhesion to many substrates
Documents
Application details
SEMICOSIL® 979 EC is an electrically conductive adhesive for use in the electronics industry.
Processing
Surface Preparation
The surface should be clean and free from any contamination. Rubber surfaces may be lightly rubbed with a fine grit sand paper and then wiped clean with a solvent to improve adhesion. SEMICOSIL® 979 EC is not recommended for use with acrylic or polycarbonate substrates.
Application
SEMICOSIL® 979 EC can be readily dispensed using conventional pail pumps equipped with a high pressure flexible fluid hose and extrusion gun. Cartridges may be dispensed with a manual or pneumatic caulking gun. Material may be spread with a spatula either from the pails or cartridges.
Packaging & Storage
Storage
The "Best use before end date" of each batch is shown on the Certificate of Analysis. Storage beyond the date specified on the Certificate of Analysis does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.Sales and support
2 Arlington Square, Downshire Way
Bracknell RG12 1WA
United Kingdom