SEMICOSIL® 924
SEMICOSIL® 924 ist ein gießbarer, thermisch vulkanisierbarer, additionsvernetzender Einkomponenten-Siliconkautschuk.
Eigenschaften
- thixotropes Fließverhalten
- niedrige Vulkanisathärte (Gel)
- geringer Gehalt an flüchtigen Bestandteilen
- wenig unvernetzte Bestandteile
- niedriger Ionengehalt
- nahezu gleichbleibende Eigenschaften zwischen -50 °C und +180 °C
Datenblätter
Dispensing Because of the thixotropy (shear thinning effect) SEMICOSIL® 924 can be dispensed easily with all dispensing equipments. To eliminate any air introduced during dispensing or trapped under components or devices a vacuum encapsulation is recommended.
Curing SEMICOSIL® 924 works best when cured at 100 °C or more depending on the size and heat sink properties of the components.
The reactivity can be adjusted within wide limits by adding Catalyst EP or Inhibitor PT 88 to suit the processing requirements of the particular application. Catalyst EP increases the reactivity, i. e., pot life and curing time are reduced. Inhibitor PT 88 is a pot life extender and prolongs pot life and curing time. Further information is given in our leaflet “Catalyst EP/Inhibitor PT88”.
1 Leerzeile
We recommend running preliminary tests to optimize conditions for the particular application.
Aufgrund der thixotropen Einstellung eignet sich SEMICOSIL® 924 besonders für die lokale Abdeckung empfindlicher Bauteile, wie z.B. gebondeten Chips auf Hybridbauelementen, die extremen äußeren Einflüssen ausgesetzt sind.
Surface preparation
All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 924. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.
Dispensing
Because of the thixotropy (shear thinning effect) SEMICOSIL® 924 can be dispensed easily with all dispensing equipments.
To eliminate any air introduced during dispensing or trapped under components or devices a vacuum encapsulation is recommended.
Curing
SEMICOSIL® 924 works best when cured at 100 °C or more depending on the size and heat sink properties of the components.
The reactivity can be adjusted within wide limits by adding Catalyst EP or Inhibitor PT 88 to suit the processing requirements of the particular application. Catalyst EP increases the reactivity, i. e., pot life and curing time are reduced.
Inhibitor PT 88 is a pot life extender and prolongs pot life and curing time. Further information is given in our leaflet “Catalyst EP/Inhibitor PT88”.
We recommend running preliminary tests to optimize conditions for the particular application.
Lagerung
Vertrieb & Support
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