- Thermally conductive adhesives
transfer the device’s heat to the heat sink. At the same time, they create a firm yet flexible mechanical bond that saves further fixing, thus reducing the manufacturing costs. Our silicone-based thermal adhesives exhibit outstanding durability and long-term reliability under permanent thermal stress. The mechanical properties remain almost constant even after 2,000 operating hours at 150 °C.
- Thermally conductive silicone encapsulants
efficiently dissipate heat even for complicated shapes. At the same time, they protect key components such as transformers and power semiconductor devices against environmental influences. Our solutions are optimized for bubble-free processing, showing good flow properties and a low viscosity.
- Thermally conductive gap fillers and pastes
are an effective alternative where no structural bond between the cooling element and device is required. They efficiently dissipate the heat and can permanently withstand shocks, vibrations and temperature fluctuations due to their soft consistency. Our solutions show a special rheology, forming a thin, homogenous layer that can easily compensate component tolerances. Already with a very thin layer optimal heat transfer can be achieved. Our portfolio today comprises silicone grades with a conductivity of up to 4 W/mK, higher values are being developed. Products with very low content of volatile siloxanes are available, some of them are even meeting the automotive specification of siloxane content D4-D8 less than 350 ppm. Excellent processability has been tested with leading equipment manufacturers. Most gap fillers are available in 200l drums to allow for efficient mass production.