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Processing Operations for Electronics

Room temperature vulcanizing silicone elastomers from WACKER reliably protect against external influences and thus ensure the functional reliability of electrical and electronic components. As one of the market leaders in silicones with many years of expertise in the special manufacturing processes and material requirements of these applications, we are a competent partner of the industry with tailor-made solutions for the areas of potting, bonding, sealing and coating.

Main Properties:

  • Sticky gels with physical adhesion (independent on substrate)
  • For applications with cover/lid
  • Low modulus (10-100 kPa)
  • Minimum thermal stress on sensitive electronics
  • Broad range of application temperatures (-45 - +180°C)
  • Superior reliability
  • Low ion levels
  • Low bleeding
  • Tailor made processing properties for fast mass production
  • Room temperature or heat cure (1-part)
  • Self-levelling and thixotropic gels
  • Excellent inherent tack
  • Repairability


  • Sensitive electronic devices
  • ECUs
  • Power Modules
  • Discrete devices (glob tops)
  • Sensors
  • Displays
  • Wire-bonded ICs

Main Properties:

  • Low viscosities of approx. 1,000 mPa*s
  • Higher resistance to mechanical and environmental stress
  • Increased internal strength
  • Suitable for applications without housing
  • Increased hardness measured in Shore 00 or Shore A


Suitable for requirements with inceased hardness, such as

  • Voltage regulators,
  • Transformer potting,
  • Coil potting or
  • Junction boxes for PV applications.

Main Properties:

  • Low modulus sealing adhesives
  • Ability to bond
  • Flowable to non-sag
  • Sealing cover/lids and housing
  • Pronounced damping properties
  • Broad temperature range (-45°C- +180°C)
  • Minimum thermal stress
  • Maximum reliability and long-term performance
  • Tailor made properties for efficient and fast production processes
  • Good vibration damping
  • Minimum thermal stress


  • Electronic components
  • FIPG and CIPG applications
  • Housing and lids made from PBT, PA and aluminum
  • Suitable for automated processes

Main Properties:

  • Versatile processing, such as dispensing and spraying


Suitable for protecting sensitive electronics, such as

  • PCBs
  • Hybrid devices
  • Surface mounted devices

Thermally conductive, addition-curing silicone products of ELASTOSIL® and SEMICOSIL® as well as WACKER silicone pastes are used for bonding and encapsulation in electronic applications and permanently secure the reliable function of the components.

Benefits of thermally conductive SEMICOSIL® adhesives:

  • High thermal conductivity (0.5-4 W / mK)
  • Good flow and processing properties
  • Excellent resistance in a temperature range from -50 °C to +150 °C
  • No embrittlement of the material
  • Minimization of contact resistance
  • Minimizing the thermal resistance of the thermal interface


  • Semiconductor devices, e.g. Insulated Gate Bipolar Transistor (IGBT)
  • Engine control units
  • LED components
  • Battery Management Systems

Benefits of SEMICOSIL® gap filler and WACKER silicone pastes:

  • Excellent resistance in a temperature range from -50 °C to +150 °C
  • Low module
  • Low level of volatile components
  • Complete curing at room temperature
  • Materials with thermal conductivities greater than 4 W / mK available
  • Gapfiller with best-in-class processing properties


  • Automotive electronics
  • Heat dissipation for applications in EV (electric vehicles) / HEV (hybrid electric vehicles), e.g. Battery Assembly and Power Electronics / On-board Charger (OBC)
  • Interface material for heat dissipation in the electronics industry
  • Consumer electronics

Advantages of ELASTOSIL® and SEMICOSIL® as heat-conductive potting materials:

  • Excellent resistance in a temperature range from -50 °C to +150 °C
  • High filler content
  • Good processing properties with relatively low viscosity


  • Automotive electronics / e-mobility
  • Assembly of electric motors
  • Casting of coils