Siltronic, Wacker Chemie AG’s semiconductor division, intends to streamline its 200 mm wafer production capacities. As a result, Siltronic plans to close its production site in Hikari, Japan, by mid-2012. The Munich-based chemical group announced this decision today. Hikari’s production volumes shall be transferred to Siltronic’s existing 200 mm wafer plants in Singapore and Portland (Oregon, USA), optimizing capacity utilization at these sites’ facilities. The planned closure is expected to involve expenses of some €70 million. Thereof, around €45 million will be cash-relevant. These expenses had not been included in WACKER’s most recent earnings forecast for fiscal 2011 which calls for earnings before interest, taxes, depreciation and amortization (EBITDA) at last year’s level. Currently, Siltronic is producing at it’s Hikari site wafers for the semiconductor industry as well as monocrystalline silicon ingots, employing a staff of some 500.
Ad-hoc disclosure of December 8, 2011
Ad-Hoc Disclosure according to Sec. 15 WpHG (German Securities Trading Act) of Dec. 8, 2011
Wacker Chemie AG / Strategic Corporate Decisions / Decommissioning of Production Capacities
WACKER Closes Semiconductor Wafer Production in Japan
Munich, Dec 08, 2011
Wacker Chemie AG
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