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Thermal Interface Material (TIM)

WACKER’s ELASTOSIL® and SEMICOSIL® thermally conductive silicone products provide efficient and reliable heat management for numerous applications in automotive, consumer and power electronics. Our silicone-based products are offered in a variety of viscosities, cure speeds and conductivities to meet the requirements of thermal management in electronics for virtually every industry.

Efficient and Reliable Products for Thermal Management.

Wide Product Portfolio in:

  • Adhesives
  • Gap fillers
  • Pastes
  • Encapsulants


  • Excellent thermal conductivity for heat dissipation (0.5 – 4.8 W/mK)
  • Maintains physical property and full performance in extreme temperatures (-45 °C to + 150° C)
  • Superb flow and processing properties for dispensing ease
  • Conforms and adheres to component shape – good wetting properties
  • Low volatile content
  • Firm yet flexible mechanical bond that doesn’t require further fixing


  • Electric vehicle batteries
  • Battery management systems (BMS)
  • Power electronics
  • On-board chargers (OBC)
  • Electronic control units (ECUs)
  • Sensors
  • Consumer electronics
  Gap Fillers Adhesives Grease / Paste Encapsulants / Potting
Thermal conductivity (TC) 1.8 – 4.8 W/mK 0.85 – 4.2 W/mK 0.7 – 4.0 W/mK 0.5 – 4.0 W/mK
Curing type Addition Addition / condensation Non-cure Addition
Viscosity Non-flowable Semi-flowable Non-flowable / pasty Flowable
Bond line thickness 50 – 150 µm < 150 µm < 150 µm < 150 µm
Processing Static mixer (2K) Static mixer (2K) Static mixer (2K), screen printing (2K) Static mixer (2K)