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Industrial Focus on Electronics

Due to their outstanding properties, WACKER silicones are indispensable In the field of electronics, optimizing a wide variety of applications. They are used, for example, as seals, encapsulation and potting materials in areas where good electrical, chemical and mechanical properties are important. Silicones work reliably over their entire service life even in critical applications. Special WACKER silicones also enable targeted protection of selected areas of a component.

Benefits:

  • Excellent resistance in a temperature range from -50 °C to +180 °C, with special types extendable down to -110 °C and as high as +220 °C
  • Very good adhesion to a wide variety of substrates
  • Excellent weathering and UV resistance
  • Outstanding dielectric properties that barely change over a wide temperature and frequency range
  • Excellent environmental compatibility
  • Water-repellent surface and low moisture absorption
  • Low modulus of elasticity
  • High chemical purity

Applications:

  • Coating and encapsulation of sensitive components (measuring instruments, system control)
  • Coating of selected areas of a component
  • Sealing of sensor elements (explosion protection, high temperature, humidity conditions)
  • Sealing of housing components
  • Sealing of MEMS microphones and speakers

Benefits:

  • High dielectric strength
  • Reliable dieelectric insulation
  • Encapsulants stay flexible as low as -120 °C
  • UV curing is an effective way to accelerate manufacturing processes

Applications:

  • Power semiconductors
  • Power generator
  • Automotive / e-mobility

Benefits:

  • Ultra-low modulus gels (encapsulation)
  • Low and high temperature grades
  • Low-modulus adhesives
  • Efficient mass production processes using fast heat-curing adhesives or moderate-temperature curing alternatives
  • Thermally conductive gap fillers, adhesive, pastes and encapsulants (0,5 – 4 W7mK)
  • Low-temperature grades allow applications below -45°C; high temperature grades up to +210°C

Applications:

  • Sealing of electronic control units and housings
  • Protect electronic components by potting or encapsulating
  • Bonding of hybrid PCBs
  • Sealing/bonding of housing components (CIPG, FIPG and preformed gaskets)
  • Coating or bonding individual elements (e.g. MEMS)
  • Thermal management solutions such as bonding to heat sinks, encapsulants and gapfillers

Benefits:

  • High reliability - excellent for harsh testing conditions
  • Low shrinkage (< 0.1%, before/after cure)
  • Mura free
  • Extremely low modulus (10 kPa -200 kPa)
  • Superior optical reliability (after aging)
  • Solutions for all relevant industrial methods of application (dam&fill, damless, slot-die coating, screen-printing, stencil printing)
  • Fast processing (UV active grades)
  • Low elastic modulus - better for one glass solution (OGS), wide temperature range
  • Low dielectric constant (2.7 – 2.8)
  • Easy to rework and cost saving
  • Flexible open time
  • No oxygen inhibition
  • No photo-initiators used

Applications:

  • Optical bonding of touchscreens
  • Encapsulation of optical and electronic components
  • Production of damping elements
  • Large format displays
  • Navigation systems