SEMICOSIL® 986/1K


特性

  •  ready-to-use, one-part system
  •  thixotropic
  •  translucent
  •  medium hardness
  •  high flexibility (low-stress-adhesive)
  •  primerless adhesion to many substrates
  •  rapid heat cure
  •  ultraviolett fluorescing
  •  general purpose adhesive for the electronics industry
  •  FIPG applications

Surface preparation
All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 986/1K. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.


Dispensing
Because of the thixotropy (shear thinning effect) SEMICOSIL® 986/1K can be dispensed easily with all dispensing equipments. Since silicones dissolve notable amounts of air, an in-line degassing is recommended.

Curing
SEMICOSIL® 986/1K works best when cured at 115 °C or more depending on the size and heat sink properties of the components.


Temperature Curing time, thickness 10 mm
100°C 6 h
130°C 30 min
150 °C 10 min

Adhesion
SEMICOSIL® 986/1K shows good primerless adhesion to many substrates. We recommend running preliminary tests to optimize conditions for the particular application.

储存

The 'Best use before end' date of each batch is shown on the product label.

SEMICOSIL® 986/1K should be stored  between +5 and +25°C in its tightly closed containers.


Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

销售和支持

Wacker Chemicals (China) Co.,Ltd.
Caohejing Hi-Tech Park
200233 Shanghai
中国大陆
+86  21  6130-2000 (电话)
+86 21 6130-2500  (传真)
Contact Sales

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