Coating
To coat a PCB populated with components, electronics manufacturers often spray the liquid silicone onto the components or spread it over them with a slot die. In the latter case, the slot die moves over the board and the silicone flows down like a liquid curtain onto the components.
Potting
In many applications, a component or circuitry assembled in a housing has to be potted. To this end, a low-viscosity silicone is poured into the space between the electronic component (or the circuit) and the walls of the housing until all the components are covered. The silicone then cures.
Glob-Top Process
A small amount of silicone encapsulant is dripped from above onto the component to be embedded. After curing, and provided it has the “right” flow properties (not too thick and not too thin), the silicone forms a dome-shaped covering, or glob-top, over the substrate.
Dam-and-Fill Process
Sometimes it is expedient to first frame the component to be embedded with a dam of shear-thinning encapsulant. Next, a low-viscosity silicone is dispensed over the component and fills the area inside the dam. A shear-thinning compound is non-sag as long as it is not subjected to shear forces, but liquefies if it is. The stronger the shear forces, the less viscous the material becomes.
Once the shear forces are removed, the viscosity immediately increases again to its original value, and the compound regains its non-sag property. When the shear-thinning silicone cures upon UV activation at room temperature, the geometrical shape applied – in this case by the pre-formed dam – becomes permanent.