SEMICOSIL® - Wacker Chemie AG


SEMICOSIL®

Curing on Command

UV-active silicones, a recent WACKER SILICONES development, cure extremely fast – but only on command; the reaction is triggered by brief UV irradiation. This innovative technology enables manufacturers of electronic components to process silicone encapsulants very efficiently.

Wherever technical processes have to be monitored and controlled, control units are needed. These are small computers that are part of an embedded system. In cars, for example, airbags, central engine-management, driving-assistance and braking-assistance systems require control units in order to operate. They usually work behind the scenes, hidden under the engine hood.

A component is embedded with a low-viscosity silicone.

The electronics have to perform reliably for many years; in safety-relevant applications, it is essential that they do not fail. The sensitive semiconductor chips, i.e. the intelligent components of the control units, are therefore protected from environmental influences by embedding them – often in silicone products.

So far, electronics manufacturers have had to make compromises when it comes to processing conventional silicone encapsulants. For example, fast curing at room temperature was only possible with two-part silicone systems, which have to be processed quickly. If, however, a long pot life – i.e. the time available for processing – was desired, long cycle times had to be taken into consideration. WACKER SILICONES therefore looked for a completely new approach to curing.

In a UV-exposure chamber, Burghausen engineers test the novel UV-active silicones’ properties.

The New Solution: UV Activation

The electronics and photonics applications lab developed addition-curing silicone systems in which curing begins as soon as they are irradiated with ultraviolet light.

Just a brief burst of radiation is all it takes to fully cure such a UV-active silicone system in a few seconds to minutes at room temperature. The secret behind its success is a special patented platinum catalyst: it is inactive in the dark; UV light converts it into an active form that triggers the crosslinking reaction.

Dr. Markus Jandke (left) and Dr. Klaus Angermaier from WACKER SILICONES test a power module that was embedded with a UV-active silicone.

Promising Technology

Recently, UV-active silicone gels and pourable silicone rubber grades – marketed under the name of SEMICOSIL® UV and tailored to the processes of electronics manufacturers – have been available. The new crosslinking technology is the key to economical large-scale production of electronic components embedded in silicone. The automotive sector, in particular, will profit from the new technology.

Thus, the potential offered by the new crosslinking technology is by no means exhausted. WACKER intends to tap into non-electronic applications as well. SEMICOSIL® UV is just the beginning.

Properties of Silicone Elastomers and Silicone Gels

Silicones are characterized by a property profile that makes them interesting for many applications. Silicone elastomers together with silicone gels, which are less densely crosslinked, are permanently stable up to at least 180 degrees Celsius. They have a strongly water-repellent (hydrophobic) surface, are electrical insulators and attenuate mechanical vibrations.

In many applications, it has proved particularly useful for the physical and technical properties of silicone elastomers and gels to remain unchanged over a wide temperature range (between -45 and +180 degrees Celsius); not even continued thermal and mechanical loads (even when exposed to oxygen and ozone) will cause them to age.
In this respect, they differ from all organic elastomers. The latter show distinctly less thermal stability, and, with time, they become brittle and crack.

UV Irradiation Systems

To cure UV-active silicone encapsulants, electronics manufacturers need a UV irradiation system. The UV radiator must have a radiation spectrum that can stimulate the platinum catalyst to convert to its active form.

In order to determine ideal curing conditions, WACKER SILICONES is cooperating for instance with Fusion UV Systems, a manufacturer of UV irradiation systems.
“The aim of our joint project is to define a process window for UV activation of the silicones – so that silicone processors can integrate the curing process smoothly and to the best advantage in their production process,” explains Petra Burger, a technical service manager at Fusion UV Systems’ German subsidiary.

All commercial UV radiators generate UV radiation by excitation of metal atoms. This involves supplying external energy to raise the outer electrons of the atoms to a higher energy level. When these electrons subsequently fall back to their “normal” energy level, they emit energy as UV radiation.

Which metal atoms are used depends on the desired radiation spectrum. To activate the platinum catalyst contained in the new silicone system, UV light in the 250 – 400-nm wavelength range is required (1 nm = 1 nanometer = 1 millionth of a millimeter).

A special feature of UV radiators supplied by Fusion UV Systems is that the metal atoms are energized by microwaves. Radiators based on this technology have an exceptionally long service life during which neither the radiant power nor the emitted UV spectrum varies. A UV irradiation setup of this kind comprises the irradiation unit, i.e. the actual UV radiator plus the microwave generators, the necessary control technology and a cooling-air system. The irradiation unit is enclosed in an opaque housing to ensure safe operation of the system and to

protect the operator from UV radiation.

How Silicones are Applied to Electronic Components

Coating

To coat a PCB populated with components, electronics manufacturers often spray the liquid silicone onto the components or spread it over them with a slot die. In the latter case, the slot die moves over the board and the silicone flows down like a liquid curtain onto the components.

Potting

In many applications, a component or circuitry assembled in a housing has to be potted. To this end, a low-viscosity silicone is poured into the space between the electronic component (or the circuit) and the walls of the housing until all the components are covered. The silicone then cures.

Glob-Top Process

A small amount of silicone encapsulant is dripped from above onto the component to be embedded. After curing, and provided it has the “right” flow properties (not too thick and not too thin), the silicone forms a dome-shaped covering, or glob-top, over the substrate.

Dam-and-Fill Process

Sometimes it is expedient to first frame the component to be embedded with a dam of shear-thinning encapsulant. Next, a low-viscosity silicone is dispensed over the component and fills the area inside the dam. A shear-thinning compound is non-sag as long as it is not subjected to shear forces, but liquefies if it is. The stronger the shear forces, the less viscous the material becomes.

Once the shear forces are removed, the viscosity immediately increases again to its original value, and the compound regains its non-sag property. When the shear-thinning silicone cures upon UV activation at room temperature, the geometrical shape applied – in this case by the pre-formed dam – becomes permanent.