Press Releases 2006

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Creating Tomorrow's Solutions

Press Releases 2006Press Releases 2006

Aug 08, 2006

DOW CORNING and WACKER receive Government approval to build Siloxanes Facility in China

Dow Corning Corporation (Midland, Michigan, USA) and Wacker Chemie AG (Munich, Germany) announce that their manufacturing joint venture company Dow Corning (Zhangjiagang) Co., Ltd. received official approval from the Chinese government to build a world-class siloxanes manufacturing facility in China.

Aug 04, 2006

WACKER SILICONES Responds to Rising Platinum Prices by Launching Low-Platinum DEHESIVE® Coating Systems and New Price Models

WACKER SILICONES responds to increasing platinum costs by launching low-platinum DEHESIVE® coating systems and new price models.

Aug 01, 2006

Strong Demand and Pricing for Semiconductor Wafers lift WACKER’s Earnings Expectations

Reflecting ongoing favorable trading conditions and further improved expectations regarding customer demand for semiconductor wafers for the second half of 2006, WACKER is raising its full-year sales and earnings forecast.

Jul 14, 2006

SAMSUNG ELECTRONICS and Siltronic to jointly construct 300 mm Wafer Fab in Singaproe

Semiconductor technology leader Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, and Siltronic AG, a division of Wacker Chemie AG and a global leader in the market for ultra-pure silicon wafers, will jointly construct and operate a 300 mm wafer fab.

Jul 06, 2006

WACKER SILICONES adjusts prices for HDK® Pyrogenic Silica

Effective September 1st, 2006, WACKER SILICONES will raise prices for HDK® Pyrogenic Silica